UQFN Component Package

Overview

Name Ultra-thin Quad Flat Non-leaded
Synonyms n/a
Variants n/a
Similar To
Mounting SMD
Pin Count 4
Pitch 5.08mm (200mill)
Solderability Can be soldered with a soldering iron with moderate experience, as long as it doesn’t have a centre pad.
Thermal Resistance n/a
Land Area n/a
Height n/a
3D Models n/a
Common Uses IC’s

Comments

An ultra-thin QFN package. Commonly used for packaging 4 or 5 TVSdiodes together.

3D Renders

A 3D render of the UQFN-28 component package.
A 3D render of the UQFN-28 component package.

Posted: April 7th, 2015 at 2:34 pm