TSSOP COMPONENT PACKAGE
TSSOP Component Package
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Overview
TSSOP (Thin Shrink Small Outline Package) is a plastic, SMD IC component package with gull-wing leads.
Synonyms:
- PWP (PowerPAD) (TI’s name for the HTSSOP variant, independent on pin count)1
- SOT1171-2 (NXP’s name for the HTSSOP-28)2
- MO-153 (JEDEC’s name for the HTSSOP-28)2
Pin Count: 8-803
Pitch:
- 0.50mm3
- 0.65mm
Solderability: Reflow is most suitable. O.K. to solder by hand by an experienced user. Care must be taken to avoid solder bridges between the legs of the IC.
Common Uses:
- General ICs
- H-bridges (the HTSSOP variant)
TSSOP
Body widths of TSSOP packages can be 3.0, 4.4 and 6.1mm3.
HTSSOP
HTSSOP
is a variant of the TSSOP
with a solder pad on the underside, used by both Texas Instruments and Rohm Semiconductor4 5. It is used for ICs which require good thermal conductivity (e.g. half-bridges, SMPS).
- \(R_{\theta JA}\): Junction-to-ambient thermal resistance.
- \(R_{\theta JB}\): Junction-to-board thermal resistance.
- \(R_{\theta JC(top)}\): Junction-to-case (top) thermal resistance.
- \(R_{\theta JC(bot)}\): Junction-to-case (bottom) thermal resistance.
Package Name | Body Size (nominal) | \(R_{\theta JA}\) | \(R_{\theta JB}\) | \(R_{\theta JC(top)}\) | \(R_{\theta JC(bot)}\) |
---|---|---|---|---|---|
HTSSOP-16 | 5.00x4.40mm4 | \(38.9^{\circ}C/W\)4 | \(16.8^{\circ}C/W\)4 | \(23.1^{\circ}C/W\)4 | \(1.7^{\circ}C/W\)4 |
HTSSOP-20 | 6.50x4.40mm4 | \(36.7^{\circ}C/W\)4 | \(18^{\circ}C/W\)4 | \(21.5^{\circ}C/W\)4 | \(1.9^{\circ}C/W\)4 |
HTSSOP-28 | 9.70x4.40mm1 | \(31.0^{\circ}C/W\)1 | \(10.8^{\circ}C/W\)1 | \(25.2 ^{\circ}C/W\)1 | \(3.3^{\circ}C/W\)1 |
References
Texas Instruments (2020, May). DRV8424E/P, DRV8425E/P Dual H-Bridge Motor Drivers With Integrated Current Sense and Smart Tune Technology. Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/drv8424e.pdf. ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎
NXP (2016, Feb 8). SOT1172-2 (Package Information). Retrieved 2021-10-13, from https://www.nxp.com/docs/en/package-information/SOT1172-2.pdf. ↩︎ ↩︎
Wikipedia (2021, Jul). Thin shrink small outline package. Retrieved 2021-10-13, from https://en.wikipedia.org/wiki/Thin_shrink_small_outline_package. ↩︎ ↩︎ ↩︎
Texas Instruments (2008, Jul). LM342x N -Channel Controllers for Constant-Current LED Drivers (Datasheet). Retrieved 2021-10-13, from https://www.ti.com/lit/ds/symlink/lm3421.pdf. ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎ ↩︎
Rohm Semiconductor (2016, Sep 19). Package Information : HTSSOP-B28. Retrieved 2021-10-13, from https://fscdn.rohm.com/en/techdata_basic/ic/package/htssop-b28_1-e.pdf. ↩︎
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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