SOT-346 Component Package

Overview

Name SOT-346 (Small Outline Transistor 346)
Synonyms
  • SC-59 (EIAJ)
  • SC-59A (EIAJ)
  • TO-236 (JEDEC)
  • SMT3 (NXP Semiconductors)
  • MPAK (NXP Semiconductors)
Variants  
Similar To n/a
Mounting SMD
Pin Count  3
Pitch  1.90mm
Solderability Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques.
Thermal Resistance

500°C/W (standard mounting conditions)

Datasheets rate BJT transistors in the SOT-346 package, mounted on a standard footprint, to a maximum of 250mW heat dissipation.

Dimensions

Body = 2.9×1.5mm
Component Area = 7.98mm² (2.9×2.75mm)
Standard Footprint Land Area = 11.22mm² (3.3×3.4mm)

3D Models n/a
Common Uses
  •  BJT transistors

Outline And Dimensions

Below is the outline and dimensions of the SOT-346 component package as specified by NXP Semiconductors.

The outline and dimensions of the SOT-346 component package. Image from http://www.nxp.com/.
The outline and dimensions of the SOT-346 component package. Image from http://www.nxp.com/.

Footprint

Below is the recommended reflow soldering footprint by NXP Semiconductors.

A recommended reflow soldering footprint (land pattern) for the SOT-346 (SC-59A) component package. Image from http://www.nxp.com/.
A recommended reflow soldering footprint (land pattern) for the SOT-346 (SC-59A) component package. Image from http://www.nxp.com/.

 

3D Render

A 3D render of the SOT-346 (SC-59A) component package.
A 3D render of the SOT-346 (SC-59A) component package.

 

Posted: October 15th, 2015 at 3:25 pm
Last Updated on: October 15th, 2015 at 3:54 pm