|Name||SOT-346 (Small Outline Transistor 346)|
|Solderability||Easy to hand-solder if you have had a bit of practise with surface mount devices before. Easy to solder with infrared or reflow techniques.|
500°C/W (standard mounting conditions)
Datasheets rate BJT transistors in the SOT-346 package, mounted on a standard footprint, to a maximum of 250mW heat dissipation.
Body = 2.9×1.5mm
Outline And Dimensions
Below is the outline and dimensions of the SOT-346 component package as specified by NXP Semiconductors.
Below is the recommended reflow soldering footprint by NXP Semiconductors.