SON Component Package

Overview

Name SON (Small-outline No-lead Package)
Synonyms
  • DFN (Linear Technology, Micron Technology Inc, this synonym is more common than the JEDEC named SON!)
  • DSG (TI)
  • PE-SON-8 (SON-8, Ricoh)
  • MLP (micro leadframe package or moulded leaded package). This also can refer to variants with pins on all four sides of the package, which is also called a QFN package). This name is used by Linear Technologies, Carsem.
  • MLPD (MLP dual).
  • MLPM (MLP micro). This name is used by Carsem.
  • MLPQ (MLP quad).
  • SW-PWSON-N8 (SON-8, TI)
  • VDFPN (Numonyx, Micron Technology)
  • WDFN-6 (SON-6, On Semiconductor/Fairchild Semiconductor)
Variants The SON package can have a varying number of pins. There are also VSON and WSON packages which are exactly the same as the SON package except for a different height.
Similar To
  • QFN (note that some may call SON a variant of QFN)
Mounting SMD
Pin Count 6, 8 (all also have exposed thermal pad)
Pitch 0.5mm
Solderability Hard to solder with a soldering iron due to underside thermal pad (some don’t have a thermal pad, and in that case, your chances are better). The tiny pitch is not so much of an issue as unlike the TQFP package, solder bridges are really easy to remove. You can solder the exposed pad in some cases by drilling a hole in the centre of the pad and soldering from the underside.
Thermal Resistance

SON-8:

  • Tja = 333°C/W (free-air)
  • Tja = 65.3°C/W (mounted on PCB with standard land pattern)
  • Tjc (bottom) = 12.8°C/W (thermal resistance between junction and the thermal pad)
Dimensions

SON-8

  • Package: 2.0×2.0x0.75mm (w*l*h)
  • Recommended Land Pattern: 2.4×1.92mm (4.61mm2)
3D Models  DSG (S-PWSON-N8)
Common Uses
  • MOSFET’s
  • Embedded SIM cards
  • Solid-state load switches
  • Flash memory ICs

Thermal Pad

The SON package has a exposed thermal pad on the underside, similar to a QFN package.

The difference between the SON and QFN package is that the SON package only has pins running down two of it’s sides, while a QFN package has pins on all four sides. It is commonly referred to as the DFN (dual-flat no-lead) package.

JEDEC standard JESD75-5 specifies how generic logic circuits will be connected to certain pins of the SON package.

Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.
Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

Thermal Resistance

For a comparable TQFP package with the same pin count, the SON package (with an exposed pad) can usually handle more than twice the power dissipation.

WSON And VSON Variants

The WSON and VSON variants of the SON package are identical to the SON package except for varying heights.

The WSON variant has a height of 0.80mm (max.)

An outline of the WSON component package showing it's height.
An outline of the WSON component package showing it’s height.

The VSON variant has a height of 1.00mm (max.)

An outline of the VSON component package showing it's height.
An outline of the VSON component package showing it’s height.

Images

 

 

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