DSOP Advance Component Package
Article by:Geoffrey Hunter
| Date Published: | |
| Last Modified: |
Overview
| Name | DSOP Advance Component Package |
| Synonyms | 2-5S1A (Toshiba) |
| Variants | n/a |
| Similar To | |
| Mounting | SMD |
| Lead-type | Pad |
| Pin Count | 10 (8 if you don't count the two pins by themselves) |
| Pitch | 1.27mm |
| Solderability | Moderately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques. |
| Thermal Resistance |
|
| Dimensions | The package is 5x6x0.73mm (nominal) |
| Weight | 98mg |
| 3D Models | n/a |
| Common Uses | High-power Toshiba MOSFETs |
Thermal Resistance
The DSOP Advance component package comes with dual-side cooling features to further decrease the thermal resistance compared to the SOP Advance component package.
Dimensions
Recommended Land Pattern
Authors
This work is licensed under a Creative Commons Attribution 4.0 International License .
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