DSOP Advance Component Package

Overview

Name DSOP Advance Component Package
Synonyms
  • 2-5S1A (Toshiba)
Variants n/a
Similar To  
Mounting SMD
Lead-type Pad
Pin Count 10 (8 if you don’t count the two pins by themselves)
Pitch 1.27mm
Solderability Moderately difficult to solder by hand, due to the small pitch. Easy to solder with hot air, infrared, or reflow techniques.
Thermal Resistance
  • \(50^{\circ}C/W\) (device mounted copper PCB with large pads designed for heatsinking)
  • \(142^{\circ}C/W\) (device mounted on¬†standard PCB with minimal pad land pattern)
Dimensions

The package is 5x6x0.73mm (nominal)

Weight

98mg

3D Models

n/a

Common Uses
  • High-power Toshiba MOSFETs

Thermal Resistance

The DSOP Advance component package comes with dual-side cooling features to further decrease the thermal resistance compared to the SOP Advance component package.

Dimensions

The dimensions for the DSOP Advance component package.
The dimensions for the DSOP Advance component package.

 

Recommended Land Pattern

The recommended land pattern for the DSOP Advance component package.
The recommended land pattern for the DSOP Advance component package.

Posted: May 13th, 2015 at 6:44 pm
Last Updated on: May 13th, 2015 at 6:59 pm