D3PAK (TO-268) Component Package


  • TO-263 (Transistor Outline 268)
  • D3PAK
  • Decawatt Package 3
  • TO-268AA (TO-268-3)
Variants n/a
Similar To
Mounting SMD
Pin Count 3
Pitch 5.461mm
Solderability Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance
  • T_{JC}: 0.24-1.18^{\circ}{\rm C}/W
  • T_{JA}: 40^{\circ}{\rm C}/W
  • T_{JA}: 21.9^{\circ}{\rm C}/W (13.5×17.5mm copper pad)
  • T_{JA}: 18^{\circ}{\rm C}/W (19×29.4mm copper pad)
Land Area n/a
Height 5.03mm
Weight 6.2g
3D Models TO-268AA (D3PAK)
Common Uses
  • Microsemi power MOSFET’s
  • Microsemi power diodes
  • Microsemi power IGBT’s


The TO-268 (D3PAK) package is bigger than the TO-263 (D2PAK) package. The D3PAK name stands for “decawatt 3 package”. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins.

It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower R_{DS(ON)} values, resulting in less power dissipation for the same current.

I have only ever seen this in the 3-pin variant (called TO-268-3).


Photo of the D3PAK (TO-268) component package.
Photo of the D3PAK (TO-268) component package.

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Posted: April 7th, 2015 at 1:01 pm

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