|Solderability||Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.|
|3D Models||TO-268AA (D3PAK)|
The TO-268 (D3PAK) package is bigger than the TO-263 (D2PAK) package. The D3PAK name stands for “decawatt 3 package”. Unlike the TO-263 package, the TO-268 package only comes in one variant with 3 pins.
It is designed to have a really low thermal resistance so that it can be used in high power applications. The larger die also means that MOSFETs in this package can have lower values, resulting in less power dissipation for the same current.
I have only ever seen this in the 3-pin variant (called TO-268-3).
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Posted: April 7th, 2015 at 1:01 pm